Toshikatsu Sudo

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2020-11-26

Top Assignees for applications by Toshikatsu Sudo

The entities that hold a legal rights for patent applications filed by inventor Sudo Toshikatsu:

Toshikatsu Sudo from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Film formation device for cutting tool provided with coating film, and film formation method for cutting tool provided with coating film

Film formation device for cutting tool provided with with coating film, and film formation method for cutting tool provided with coating film

InventorID:

1878008 ⎘