MICHAEL B. VINCENT

City:

PHOENIX, Arizona

Country:

United States

Published Applications:

Last publication date:

2018-03-01

Top Assignees for applications by MICHAEL B. VINCENT

The entities that hold a legal rights for patent applications filed by inventor VINCENT MICHAEL B.:

MICHAEL B. VINCENT from PHOENIX, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Fan-out wafer level packages having preformed embedded ground plane connections

Microelectronic packages having embedded sidewall substrates and methods for the producing thereof

InventorID:

1880817 ⎘