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Inventor profile of:

Munehide SAIMEN

City:

Suwa

Country:

Japan

Published Applications:

15

Last publication date:

2018-03-08

Top Assignees for applications by Munehide SAIMEN

The entities that hold a legal rights for patent applications filed by inventor SAIMEN Munehide:

SEIKO EPSON CORPORATION 15 Tokyo, Japan
SEIKO EPSON CORPORATION 2 , Japan
SEIKO EPSON CORPORATION 1 Shinjuku-ku, Japan

Recent patent applications by SAIMEN Munehide

Munehide SAIMEN from Suwa, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-03-08

US20180065365A1

Performing operations; transporting

Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus

#2 | 2017-12-28

US20170368826A1

Performing operations; transporting

MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

#3 | 2017-11-02

US20170313074A1

Performing operations; transporting

MEMS device, liquid ejecting head, and liquid ejecting apparatus

#4 | 2017-09-21

US20170266972A1

Performing operations; transporting

Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus

#5 | 2017-09-21

US20170266971A1

Performing operations; transporting

Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus

#6 | 2017-08-10

US20170225464A1

Performing operations; transporting

Piezoelectric device, liquid ejecting head, and liquid ejecting apparatus

#7 | 2017-08-03

US20170217175A1

Performing operations; transporting

MEMS device and liquid ejecting head

#8 | 2017-05-25

US20170144442A1

Performing operations; transporting

MEMS device, liquid ejecting head, and liquid ejecting apparatus

#9 | 2015-06-11

US20150160505A1

Electro-optic device and electronic apparatus

#10 | 2012-09-20

US20120236514A1

Electrooptic substrate, electrooptic device, and electronic apparatus

#11 | 2011-05-26

US20110122356A1

Electro-optical device and electronic apparatus

#12 | 2009-08-06

US20090197111A1

Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical device

#13 | 2009-07-16

US20090178522A1

Method for manufacturing flexible substrate and flexible substrate punching device

#14 | 2009-01-22

US20090020867A1

Semiconductor device

#15 | 2008-04-03

US20080078491A1

Performing operations; transporting

Method for manufacturing wiring substrate having sheet

InventorID:

1883475 ⎘