Na Ein LEE

City:

Seoul

Country:

South Korea

Published Applications:

Last publication date:

2018-12-27

Top Assignees for applications by Na Ein LEE

The entities that hold a legal rights for patent applications filed by inventor LEE Na Ein:

Samsung Electronics Co., Ltd. 2 Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, South Korea
Samsung Electronics Co., Ltd 1 , South Korea

Na Ein LEE from Seoul, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer bonding apparatus and wafer bonding system including the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

InventorID:

1898351 ⎘