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Inventor profile of:

John Bordeau

City:

Lima, New York

Country:

United States

Published Applications:

2

Last publication date:

2017-06-15

Recent patent applications by Bordeau John

John Bordeau from Lima, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-06-15

US20170169187A1

STICK PACK PACKAGING WITH INTEGRATED CIRCUIT

#2 | 2017-06-15

US20170166380A1

Performing operations; transporting

STICK PACK DESIGN

InventorID:

1901327 ⎘