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Inventor profile of:

JEAN AUDET

City:

QUEBEC

Country:

Canada

Published Applications:

8

Last publication date:

2019-06-06

Top Assignees for applications by JEAN AUDET

The entities that hold a legal rights for patent applications filed by inventor AUDET JEAN:

  • INTERNATIONAL BUSINESS MACHINES CORPORATION 8 ARMONK, NY United States

Recent patent applications by AUDET JEAN

JEAN AUDET from QUEBEC, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-06-06
US20190172784A1
Electricity

Multi terminal capacitor within input output path of semiconductor package interconnect

#2 | 2018-03-08
US20180068945A1
Electricity

Multi terminal capacitor within input output path of semiconductor package interconnect

#3 | 2018-02-22
US20180053717A1
Electricity

Multi terminal capacitor within input output path of semiconductor package interconnect

#4 | 2018-01-11
US20180012838A1
Electricity

Multi terminal capacitor within input output path of semiconductor package interconnect

#5 | 2017-06-15
US20170170134A1
Electricity

Flip chip assembly with connected component

#6 | 2017-06-15
US20170170133A1
Electricity

Flip chip assembly with connected component

#7 | 2017-01-24
US14969765
Electricity

Flip chip assembly with connected component

#8 | 2008-10-16
US20080252308A1
Physics

Power grid structure to optimize performance of a multiple core processor

InventorID:

1904879 ⎘

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