RICHARD LANGLOIS

City:

QUEBEC

Country:

Canada

Published Applications:

Last publication date:

2017-06-15

Top Assignees for applications by RICHARD LANGLOIS

The entities that hold a legal rights for patent applications filed by inventor LANGLOIS RICHARD:

RICHARD LANGLOIS from QUEBEC, CA has applied for patents for these inventions. The list has both pending applications and granted patents:

Flip chip assembly with connected component

Flip chip assembly with connected component

Flip chip assembly with connected component

Method and apparatus for electrical commoning of circuits

InventorID:

1904881 ⎘