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Inventor profile of:

Kai Zoschke

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2025-06-19

Top Assignees for applications by Kai Zoschke

The entities that hold a legal rights for patent applications filed by inventor Zoschke Kai:

Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. 3 Munich, Germany
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. 3 Munchen, Germany
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V 2 Munich, Germany
Huawei Technologies Duesseldorf GmbH 1 Duesseldorf, Germany
HORST SIEDLE GMBH & CO. KG 1 Furtwangen, Germany
FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 1 Munich, Germany
Technische Universitat Berlin 1 Berlin, Germany

Recent patent applications by Zoschke Kai

Kai Zoschke from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-06-19

US20250203764A1

Electricity

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

#2 | 2024-07-04

US20240224417A1

Electricity

Method for producing a carrier arrangement

#3 | 2022-10-06

US20220319902A1

Electricity

MASSIVE PARALLEL ASSEMBLY METHOD

#4 | 2022-05-19

US20220158619A1

Electricity

METHOD FOR PRODUCING SEALED FUNCTIONAL ELEMENTS

#5 | 2022-03-24

US20220095450A1

Electricity

CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT

#6 | 2021-01-21

US20210018679A1

Physics

Markup system for optical system, carrier substrate, and method for manufacturing of same

#7 | 2019-08-15

US20190252772A1

Electricity

Module unit having integrated antennas

#8 | 2019-03-21

US20190088490A1

Electricity

Method for manufacturing a semiconductor component and a semiconductor component

#9 | 2017-08-17

US20170236799A1

Electricity

Bonding method for connecting two wafers

#10 | 2017-07-06

US20170194257A1

Electricity

Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer

#11 | 2017-06-15

US20170170141A1

Electricity

Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer

#12 | 2009-11-05

US20090273910A1

Electricity

Functional Unit And Method For The Production Thereof

InventorID:

1904889 ⎘