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Inventor profile of:

Hui YANG

City:

Middlesex, New Jersey

Country:

United States

Published Applications:

2

Last publication date:

2017-06-22

Recent patent applications by YANG Hui

Hui YANG from Middlesex, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-06-22

US20170174958A1

Chemistry; metallurgy

HOT MELT ADHESIVE COMPOSITIONS AND USE THEREOF

#2 | 2011-06-23

US20110147672A1

Chemistry; metallurgy

THIXOTROPIC CONDUCTIVE COMPOSITION

InventorID:

1908832 ⎘