WILLIAM E. BOND

City:

Williamstown, Pennsylvania

Country:

United States

Published Applications:

Last publication date:

2017-06-29

Top Assignees for applications by WILLIAM E. BOND

The entities that hold a legal rights for patent applications filed by inventor BOND WILLIAM E.:

LEAR CORPORATION 1 Southfield, MI United States

Recent patent applications by BOND WILLIAM E.

WILLIAM E. BOND from Williamstown, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-06-29

US20170181505A1

Human necessities

Eco loop closure fabric

InventorID:

1914071 ⎘