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Inventor profile of:

Dee Wu

City:

Shanghai

Country:

China

Published Applications:

10

Last publication date:

2022-05-26

Top Assignees for applications by Dee Wu

The entities that hold a legal rights for patent applications filed by inventor Wu Dee:

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA 7 Shanghai, China

Recent patent applications by Wu Dee

Dee Wu from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-05-26

US20220165551A1

Bottom electrode assembly, plasma processing apparatus, and method of replacing focus ring

#2 | 2022-05-19

US20220157570A1

PLASMA PROCESSING APPARATUS AND METHOD OF ADJUSTING THE SAME

#3 | 2022-01-06

US20220005677A1

Control method for multi-zone active-matrix temperature control in plasma processing apparatus

#4 | 2021-04-22

US20210118716A1

ELECTROSTATIC CHUCK, METHOD OF MANUFACTURING ELECTROSTATIC CHUCK, AND PLASMA PROCESSING APPARATUS

#5 | 2020-12-03

US20200381213A1

Corrosion-resistant structure for a gas delivery system in a plasma processing apparatus

#6 | 2020-07-02

US20200214087A1

Plasma reactor and heating apparatus therefor

#7 | 2020-07-02

US20200211873A1

Temperature Control Apparatus for Semiconductor Processing Equipment, And Temperature Control Method for The Same

#8 | 2019-05-09

US20190139745A1

Uniform pumping dual-station vacuum processor

#9 | 2017-06-29

US20170186592A1

MULTI-ZONE ACTIVE-MATRIX TEMPERATURE CONTROL SYSTEM AND TEMPERATURE CONTROL METHOD, AND ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS APPLY THEREOF

#10 | 2017-06-29

US20170186585A1

ELECTRODE STRUCTURE FOR ICP ETCHER

InventorID:

1918579 ⎘