Hsinchu
Taiwan
72
2026-05-14
The entities that hold a legal rights for patent applications filed by inventor Pan Kuo Lung:
Kuo Lung Pan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
#2 | 2025-11-13SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#3 | 2025-10-30INTEGRATED CIRCUIT PACKAGE AND METHOD
#4 | 2025-10-23TRIMMING AND SAWING PROCESSES IN THE FORMATION OF WAFER-FORM PACKAGES
#5 | 2025-10-16Integrated Circuit Package and Method
#6 | 2025-09-25INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
#7 | 2025-03-20INTEGRATED CIRCUIT STRUCTURE AND METHOD
#8 | 2024-11-28BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
#9 | 2024-11-07Integrated Circuit Package and Method
#10 | 2024-10-24PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
#11 | 2024-09-05METHODS OF FORMING SEMICONDUCTOR PACKAGES
#12 | 2024-06-20SEMICONDUCTOR STRUCTURE
#13 | 2024-04-04Integrated Circuit Package and Method
#14 | 2024-02-29Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer
#15 | 2024-02-22SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#16 | 2024-02-08SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#17 | 2024-01-18Alignment Mark Design for Wafer-Level Testing and Method Forming the Same
#18 | 2023-11-16Integrated circuit structure and method
#19 | 2023-09-28Semiconductor Package and Method of Forming the Same
#20 | 2023-09-14Chip package and method of forming the same
#21 | 2023-07-13Semiconductor package and manufacturing method of semiconductor package
#22 | 2023-06-08Trimming and Sawing Processes in the Formation of Wafer-Form Packages
#23 | 2023-04-06Integrated circuit packages having support rings
#24 | 2023-03-23Methods of forming semiconductor packages
#25 | 2023-03-02Semiconductor structure and method of forming the same
#26 | 2023-02-16Integrated Circuit Package and Method
#27 | 2022-12-29SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#28 | 2022-12-01Multi-chip semiconductor package
#29 | 2022-11-10Packages with thick RDLs and thin RDLs stacked alternatingly
#30 | 2022-11-10Integrated circuit package and method
#31 | 2022-11-10Package structure
#32 | 2022-10-27Integrated circuit structure and method
#33 | 2022-10-20Bonding passive devices on active dies to form 3D packages
#34 | 2022-10-20Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer
#35 | 2022-08-18Package structure and manufacturing method of package structure thereof
#36 | 2022-08-04Integrated Fan-Out Packages and Methods of Forming the Same
#37 | 2022-05-19Package structure and method of manufacturing the same
#38 | 2022-03-31Chip package and method of forming the same
#39 | 2022-03-10Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure
#40 | 2022-02-03Package structure
#41 | 2022-01-13Package structure and method of forming the same
#42 | 2021-12-23Packages with thick RDLs and thin RDLs stacked alternatingly
#43 | 2021-12-16Segregated power and ground design for yield improvement
#44 | 2021-10-21Semiconductor package and method
#45 | 2021-09-30Semiconductor package and manufacturing method of semiconductor package
#46 | 2021-08-26Integrated circuit package and method
#47 | 2021-08-05Package structure and manufacturing method of package structure thereof
#48 | 2021-07-29Integrated circuit package and method
#49 | 2021-07-01Segregated power and ground design for yield improvement
#50 | 2021-03-25Multi-chip semiconductor package
#51 | 2021-03-04Bonding passive devices on active device dies to form 3D packages
#52 | 2021-01-21Package structure and method of manufacturing the same
#53 | 2020-12-17Integrated circuit package and method
#54 | 2020-09-03Chip package and method of forming the same
#55 | 2020-08-06Integrated fan-out package
#56 | 2020-07-30Integrated circuit package and method
#57 | 2020-07-02Integrated circuit package and method
#58 | 2020-07-02Method of forming integrated circuit packages with mechanical braces
#59 | 2020-05-19Chip package and method of forming the same
#60 | 2020-03-19Semiconductor package and manufacturing method of semiconductor package
#61 | 2020-03-05Integrated fan-out packages and methods of forming the same
#62 | 2020-01-02Semiconductor package and method
#63 | 2019-10-10Multi-chip semiconductor package
#64 | 2019-05-02Semiconductor packages and methods of forming the same
#65 | 2019-04-25Dual-sided integrated fan-out package
#66 | 2018-08-16Chip package with fan-out structure
#67 | 2018-04-26Integrated circuit package and method of forming same
#68 | 2017-11-30Warpage control of semiconductor die package
#69 | 2017-11-02Structure and formation method of chip package with fan-out structure
#70 | 2017-07-27Dual-sided integrated fan-out package
#71 | 2017-06-29Packaging device having plural microstructures disposed proximate to die mounting region
#72 | 2017-05-30Semiconductor device
1918654 ⎘