Inventor profile of:

Mark David Jaffe

City:

Shelburne, Vermont

Country:

United States

Published Applications:

20

Last publication date:

2025-07-01

Top Assignees for applications by Mark David Jaffe

The entities that hold a legal rights for patent applications filed by inventor Jaffe Mark David:

Recent patent applications by Jaffe Mark David

Mark David Jaffe from Shelburne, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-07-01
US18632960
Electricity

Under-source body contact

#2 | 2018-07-19
US20180204926A1
Electricity

TRANSISTOR USING SELECTIVE UNDERCUT AT GATE CONDUCTOR AND GATE INSULATOR CORNER

#3 | 2017-06-29
US20170186845A1
Electricity

SOI-MOSFET gate insulation layer with different thickness

#4 | 2011-12-08
US20110302542A1
Physics

Double-sided integrated circuit chips

#5 | 2011-10-06
US20110241082A1
Electricity

Double-sided integrated circuit chips

#6 | 2011-03-17
US20110062542A1
Electricity

Structures, design structures and methods of fabricating global shutter pixel sensor cells

#7 | 2010-02-25
US20100044759A1
Electricity

Double-sided integrated circuit chips

#8 | 2009-05-14
US20090121287A1
Electricity

DUAL WIRED INTEGRATED CIRCUIT CHIPS

#9 | 2009-05-14
US20090121260A1
Physics

Double-sided integrated circuit chips

#10 | 2009-03-12
US20090065925A1
Electricity

Dual-sided chip attached modules

#11 | 2008-12-18
US20080308948A1
Electricity

Wafer-to-wafer alignments

#12 | 2008-09-04
US20080213948A1
Electricity

Dual wired integrated circuit chips

#13 | 2008-06-05
US20080128812A1
Electricity

Dual wired integrated circuit chips

#14 | 2007-11-22
US20070267746A1
Electricity

Dual-sided chip attached modules

#15 | 2007-11-22
US20070267723A1
Electricity

Double-sided integrated circuit chips

#16 | 2007-11-22
US20070267698A1
Electricity

Dual wired integrated circuit chips

#17 | 2007-10-23
US11383563
-

Dual wired integrated circuit chips

#18 | 2007-07-12
US20070158711A1
Electricity

CMOS sensors having charge pushing regions

#19 | 2007-06-14
US20070132067A1
Electricity

Wafer-to-wafer alignments

#20 | 2007-03-20
US11275112
-

Wafer-to-wafer alignments

InventorID:

1918771 ⎘