Naoki KAWASHIMA

City:

Aichi

Country:

Japan

Published Applications:

Last publication date:

2024-11-07

Top Assignees for applications by Naoki KAWASHIMA

The entities that hold a legal rights for patent applications filed by inventor KAWASHIMA Naoki:

Naoki KAWASHIMA from Aichi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

ANTI-DUST COATING

THERMAL BARRIER COATING MATERIAL AND ARTICLE

THERMAL BARRIER COATING

Environmental barrier coating

Low-adhesion material, resin molding die, and soil resistant material

Low Adhesion Material, Resin Molding Die, and Soil Resistant Material

Method of evaluating adhesion property, low-adhesion material, and mold for molding resin

Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material

InventorID:

1922016 ⎘