Oswin Ehrmann

City:

Berlin

Country:

Germany

Published Applications:

Last publication date:

2017-07-06

Top Assignees for applications by Oswin Ehrmann

The entities that hold a legal rights for patent applications filed by inventor Ehrmann Oswin:

Oswin Ehrmann from Berlin, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer

InventorID:

1925069 ⎘