Inventor profile of:

David Horsley

City:

Berkeley, California

Country:

United States

Published Applications:

19

Last publication date:

2022-10-27

Top Assignees for applications by David Horsley

The entities that hold a legal rights for patent applications filed by inventor Horsley David:

Recent patent applications by Horsley David

David Horsley from Berkeley, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-10-27
US20220342069A1
Physics

Surface type detection

#2 | 2022-10-20
US20220331837A1
Performing operations; transporting

Programmable ultrasonic transceiver

#3 | 2021-05-27
US20210156993A1
Physics

Surface type detection

#4 | 2020-10-15
US20200328821A1
Electricity

Programmable ultrasonic transceiver

#5 | 2020-08-20
US20200266798A1
Electricity

Micromachined ultrasound transducer using multiple piezoelectric materials

#6 | 2020-07-14
US16165890
Physics

Ultrasonic input device

#7 | 2020-01-07
US15436726
Physics

Baseband control electronics for inertial wave angle gyroscope

#8 | 2019-06-27
US20190193116A1
Performing operations; transporting

Piezoelectric micromachined ultrasonic transducers having stress relief features

#9 | 2019-03-21
US20190089468A1
Electricity

Programmable ultrasonic transceiver

#10 | 2018-09-20
US20180268796A1
Physics

Miniature ultrasonic transducer package

#11 | 2018-08-30
US20180248477A1
Electricity

Efficient on-chip high-voltage driver circuit for ultrasonic transducer

#12 | 2018-08-30
US20180246193A1
Physics

Quadrature amplitude modulation circuitry for ultrasonic transducer

#13 | 2017-08-17
US20170236506A1
Physics

Package waveguide for acoustic sensor with electronic delay compensation

#14 | 2017-07-06
US20170194934A1
Electricity

Micromachined ultrasound transducer using multiple piezoelectric materials

#15 | 2006-04-04
US9812066
-

Three dimensional optical switches and beam steering modules

#16 | 2005-10-18
US10066213
-

Method for dicing wafer stacks to provide access to interior structures

#17 | 2005-09-01
US20050191791A1
Electricity

Methods for dicing wafer stacks to provide access to interior structures

#18 | 2005-08-23
US10747875
-

PWM-based measurement interface for a micro-machined electrostatic actuator

#19 | 2005-02-03
US20050023547A1
Performing operations; transporting

MEMS having a three-wafer structure

InventorID:

1925528 ⎘