Inventor profile of:

Sung-Eun PARK

City:

Daejeon

Country:

South Korea

Published Applications:

27

Last publication date:

2026-05-07

Top Assignees for applications by Sung-Eun PARK

The entities that hold a legal rights for patent applications filed by inventor PARK Sung-Eun:

Recent patent applications by PARK Sung-Eun

Sung-Eun PARK from Daejeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-05-07
US20260125553A1
Chemistry; metallurgy

A RESIN COMPOSITION AND A BIODEGRADABLE RESIN MOLDED PRODUCT COMPRISING THE SAME

#2 | 2025-12-04
US20250368816A1
Chemistry; metallurgy

RESIN COMPOSITION AND MOLDED ARTICLE

#3 | 2025-12-04
US20250368775A1
Chemistry; metallurgy

BRANCHED POLYLACTIC ACID POLYMER AND METHOD FOR PREPARING THE SAME

#4 | 2025-10-30
US20250333597A1
Chemistry; metallurgy

RESIN COMPOSITION AND MOLDED ARTICLE

#5 | 2025-10-30
US20250333589A1
Chemistry; metallurgy

RESIN COMPOSITION AND MOLDED ARTICLE

#6 | 2025-06-05
US20250177961A1
Performing operations; transporting

CATALYST FOR MANUFACTURING CARBON NANOTUBES

#7 | 2025-02-13
US20250054966A1
Electricity

POSITIVE ELECTRODE AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME

#8 | 2024-08-29
US20240287303A1
Chemistry; metallurgy

Graft Copolymer, Curable Resin Composition, and Adhesive Composition

#9 | 2024-08-29
US20240286117A1
Performing operations; transporting

METHOD FOR PREPARING CARBON NANOTUBE-PRODUCING CATALYST

#10 | 2024-08-29
US20240286116A1
Performing operations; transporting

CATALYST FOR PRODUCING CARBON NANOTUBES

#11 | 2024-08-22
US20240279066A1
Chemistry; metallurgy

BUNDLE-TYPE CARBON NANOTUBES

#12 | 2023-02-23
US20230053926A1
Performing operations; transporting

BATCH-TYPE STIRRER FOR SUSPENSION POLYMERIZATION OF POLYVINYL CHLORIDE RESIN, AND BATCH-TYPE SUSPENSION POLYMERIZATION REACTOR USING SAME

#13 | 2020-05-21
US20200159058A1
Physics

Substrate

#14 | 2020-04-30
US20200131386A1
Chemistry; metallurgy

Ink composition for 3D printing supporter and 3D printing production method using same

#15 | 2019-09-19
US20190285794A1
Physics

Waveguide having light shielding film formed thereon and manufacturing method therefor

#16 | 2018-10-04
US20180281293A1
Performing operations; transporting

METHOD FOR FORMING THREE-DIMENSIONAL OBJECT

#17 | 2018-08-02
US20180215937A1
Chemistry; metallurgy

Ink composition for 3D printing support and 3D printing manufacturing method using the same

#18 | 2017-10-19
US20170298241A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#19 | 2017-10-05
US20170283634A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#20 | 2017-10-05
US20170283633A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#21 | 2017-09-28
US20170275480A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#22 | 2017-08-10
US20170227844A1
Physics

Photosensitive colored ink composition for bezel, bezel pattern formed by using same, and display substrate containing same

#23 | 2017-08-03
US20170218212A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#24 | 2017-07-13
US20170198157A1
Chemistry; metallurgy

UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby

#25 | 2009-04-09
US20090093110A1
Electricity

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

#26 | 2006-07-06
US20060145343A1
Electricity

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

#27 | 2006-01-12
US20060006536A1
Electricity

BGA package with concave shaped bonding pads

InventorID:

1928239 ⎘