Peter S. Andrews

Multi-lens LED-array optic system

Light emitting diode (LED) components including contact expansion frame

Wire bonded light emitting diode (LED) components including reflective layer

MULTIPLE DIE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME

Systems and Methods for Application of Coatings Including Thixotropic Agents onto Optical Elements, and Optical Elements Having Coatings Including Thixotropic Agents

Submount-free light emitting diode (LED) components and methods of fabricating same

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Light emitting diodes including current spreading layer and barrier sublayers

Inverted Curing of Liquid Optoelectronic Lenses

Multi-chip light emitter packages and related methods

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Methods of forming optical conversion material caps

Multi-die LED package

High voltage array light emitting diode (LED) devices and fixtures

Multi-lens LED-array optic system

LED-array light source with aspect ratio greater than 1

Light emitting diodes including barrier sublayers

Structures and substrates for mounting optical elements and methods and devices for providing the same background

Light emitting diode (LED) arrays including direct die attach and related assemblies

Conformally coated light emitting devices and methods for providing the same

Multiple configuration light emitting devices and methods

Semiconductor light emitting devices with densely packed phosphor layer at light emitting surface

Semiconductor light emitting devices with optical coatings and methods of making same

Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants

Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids

Solid state light emitting diode packages with leadframes and ceramic material

Solid state light emitting apparatus with thermal management structures and methods of manufacturing

Semiconductor light emitting devices with applied wavelength conversion materials and methods for forming the same

Electronic device submounts with thermally conductive vias and light emitting devices including the same

Methods for combining light emitting devices in a package and packages including combined light emitting devices

Light emitting diodes including barrier layers/sublayers and manufacturing methods therefor

Semiconductor light emitting devices with applied wavelength conversion materials

LED chip design for white conversion

Light emitting devices for light conversion and semiconductor chips for fabricating the same

OPTICAL PREFORMS FOR SOLID STATE LIGHT EMITTING DICE, AND METHODS AND SYSTEMS FOR FABRICATING AND ASSEMBLING SAME

Power surface mount light emitting die package

Methods of manufacturing light emitting diodes including barrier layers/sublayers

Systems for assembling components on submounts and methods therefor

Systems for assembling components on submounts and methods therefor

Light emitting diodes including barrier layers/sublayers

Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same

Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same

Methods of fabricating light emitting devices using mesa regions and passivation layers