Eiji WATANABE

City:

Kirishima

Country:

Japan

Published Applications:

Last publication date:

2017-08-03

Top Assignees for applications by Eiji WATANABE

The entities that hold a legal rights for patent applications filed by inventor WATANABE Eiji:

Eiji WATANABE from Kirishima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor packaging structure and package having stress release structure

InventorID:

1948959 ⎘