Inventor profile of:

Takashi Nishimura

City:

Osaka

Country:

Japan

Published Applications:

19

Last publication date:

2022-06-02

Top Assignees for applications by Takashi Nishimura

The entities that hold a legal rights for patent applications filed by inventor Nishimura Takashi:

Recent patent applications by Nishimura Takashi

Takashi Nishimura from Osaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-06-02
US20220172027A1
Physics

INFERENCE EXECUTION METHOD

#2 | 2021-09-09
US20210278765A1
Physics

Resist composition and method for producing resist pattern, and method for producing plated molded article

#3 | 2018-04-26
US20180113382A1
Physics

Salt, acid generator, resin, resist composition and method for producing resist pattern

#4 | 2017-06-15
US20170168393A1
Physics

Photoresist composition

#5 | 2016-11-17
US20160334702A1
Physics

Salt, acid generator, resin, resist composition and method for producing resist pattern

#6 | 2016-10-06
US20160291467A1
Physics

Resin, resist composition and method for producing resist pattern

#7 | 2016-10-06
US20160291465A1
Physics

Resist composition and method for producing resist pattern

#8 | 2016-03-17
US20160077431A1
Physics

Resin, resist composition and method for producing resist pattern

#9 | 2016-03-17
US20160077430A1
Physics

Resin, resist composition and method for producing resist pattern

#10 | 2016-02-25
US20160052877A1
Chemistry; metallurgy

Salt, resin, resist composition and method for producing resist pattern

#11 | 2014-01-02
US20140003742A1
Physics

Transposition operation device, integrated circuit for the same, and transposition method

#12 | 2013-04-18
US20130094777A1
Physics

Image compression device, image compression method, integrated circuit, program, and picture display apparatus

#13 | 2012-11-22
US20120294487A1
Physics

Object detecting device, image dividing device, integrated circuit, method of detecting object, object detecting program, and recording medium

#14 | 2012-06-21
US20120153342A1
Electricity

DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

#15 | 2012-05-17
US20120122034A1
Physics

Resin and photoresist composition comprising the same

#16 | 2012-05-10
US20120115082A1
Chemistry; metallurgy

Resin and photoresist composition comprising the same

#17 | 2012-03-22
US20120070778A1
Chemistry; metallurgy

Resin, resist composition and method for producing resist pattern

#18 | 2010-07-08
US20100171414A1
Electricity

Sealing agent for optical semiconductor element, and optical semiconductor element

#19 | 2009-04-09
US20090091045A1
Chemistry; metallurgy

Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device

InventorID:

196003 ⎘