Yousuke HIROTA

City:

Chiba

Country:

Japan

Published Applications:

Last publication date:

2017-08-24

Top Assignees for applications by Yousuke HIROTA

The entities that hold a legal rights for patent applications filed by inventor HIROTA Yousuke:

DIC Corporation 1 Tokyo, Japan

Recent patent applications by HIROTA Yousuke

Yousuke HIROTA from Chiba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-08-24

US20170240690A1

Chemistry; metallurgy

Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article

InventorID:

1964827 ⎘