Beijing
China
8
2024-10-08
The entities that hold a legal rights for patent applications filed by inventor Lu Xinchun:
Xinchun Lu from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for determining thickness of metal film of wafer, polishing device, and medium
#2 | 2014-03-06Device for globally measuring thickness of metal film
#3 | 2014-01-02Measuring device for measuring film thickness of silicon wafer
#4 | 2013-10-17WAFER TRANSFER DEVICE FOR CHEMICAL MECHANICAL POLISHING APPARATUS
#5 | 2013-08-15Method for measuring thickness of film on wafer edge
#6 | 2013-05-23Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same
#7 | 2013-01-03Device and Method for Measuring Thickness of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device
#8 | 2012-05-10PAD CONDITIONER HEAD FOR CONDITIONING A POLISHING PAD
1973 ⎘