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Inventor profile of:

Kurt J. Bossart

City:

Eagle, Idaho

Country:

United States

Published Applications:

5

Last publication date:

2021-02-11

Top Assignees for applications by Kurt J. Bossart

The entities that hold a legal rights for patent applications filed by inventor Bossart Kurt J.:

  • Micron Technology, Inc. 5 Boise, ID United States

Recent patent applications by Bossart Kurt J.

Kurt J. Bossart from Eagle, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-02-11
US20210041495A1
Physics

Inductive testing probe apparatus for testing semiconductor die and related systems and methods

#2 | 2019-11-07
US20190341378A1
Electricity

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

#3 | 2019-06-13
US20190178933A1
Physics

Inductive testing probe apparatus for testing semiconductor die and related systems and methods

#4 | 2019-03-21
US20190088637A1
Electricity

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

#5 | 2017-09-07
US20170256501A1
Electricity

Methods of forming semiconductor devices including determining misregistration between semiconductor levels and related apparatuses

InventorID:

1978414 ⎘

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