Inventor profile of:

Vignesh Sundar

City:

Sunnyvale, California

Country:

United States

Published Applications:

32

Last publication date:

2026-04-16

Top Assignees for applications by Vignesh Sundar

The entities that hold a legal rights for patent applications filed by inventor Sundar Vignesh:

Recent patent applications by Sundar Vignesh

Vignesh Sundar from Sunnyvale, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2026-04-16
US20260107689A1
Electricity

DUAL MAGNETIC TUNNEL JUNCTION DEVICES FOR MAGNETIC RANDOM ACCESS MEMORY (MRAM)

#2 | 2025-10-30
US20250338775A1
Electricity

Multilayer Structure for Reducing Film Roughness in Magnetic Devices

#3 | 2025-05-22
US20250169373A1
Electricity

MTJ DEVICE PERFORMANCE BY ADDING STRESS MODULATION LAYER TO MTJ DEVICE STRUCTURE

#4 | 2023-11-16
US20230371398A1
Electricity

MTJ device performance by adding stress modulation layer to MTJ device structure

#5 | 2023-03-02
US20230060687A1
Electricity

Dual Magnetic Tunnel Junction Devices For Magnetic Random Access Memory (Mram)

#6 | 2022-12-01
US20220384718A1
Electricity

Silicon oxynitride based encapsulation layer for magnetic tunnel junctions

#7 | 2022-12-01
US20220384716A1
Electricity

Nitride capping layer for spin torque transfer (STT) magnetoresistive random access memory (MRAM)

#8 | 2022-12-01
US20220384713A1
Electricity

MTJ device performance by adding stress modulation layer to mtj device structure

#9 | 2022-11-10
US20220359821A1
Electricity

Post treatment to reduce shunting devices for physical etching process

#10 | 2021-12-02
US20210375343A1
Physics

Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer

#11 | 2021-01-21
US20210020831A1
Electricity

Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions

#12 | 2020-10-15
US20200328345A1
Electricity

Post treatment to reduce shunting devices for physical etching process

#13 | 2020-09-03
US20200279993A1
Electricity

Nitride capping layer for spin torque transfer (STT) magnetoresistive random access memory (MRAM)

#14 | 2020-07-30
US20200243125A1
Physics

Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer

#15 | 2020-05-07
US20200144492A1
Electricity

Combined physical and chemical etch to reduce magnetic tunnel junction (MTJ) sidewall damage

#16 | 2020-05-07
US20200144488A1
Electricity

Dual magnetic tunnel junction devices for magnetic random access memory (MRAM)

#17 | 2020-04-30
US20200136025A1
Electricity

Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions

#18 | 2020-04-23
US20200127192A1
Electricity

Silicon oxynitride based encapsulation layer for magnetic tunnel junctions

#19 | 2020-03-05
US20200075844A1
Electricity

MTJ device performance by adding stress modulation layer to MTJ device structure

#20 | 2019-12-31
US16056791
Electricity

Dual magnetic tunnel junction devices for magnetic random access memory (MRAM)

#21 | 2019-11-07
US20190341542A1
Electricity

Method for fabricating a magnetic tunneling junction (MTJ) structure

#22 | 2019-09-26
US20190295615A1
Physics

Free layer structure in magnetic random access memory (MRAM) for Mo or W perpendicular magnetic anisotropy (PMA) enhancing layer

#23 | 2019-09-12
US20190280197A1
Electricity

Post treatment to reduce shunting devices for physical etching process

#24 | 2019-08-01
US20190237661A1
Electricity

Nitride capping layer for spin torque transfer (STT)-magnetoresistive random access memory (MRAM)

#25 | 2019-06-20
US20190189910A1
Electricity

Low resistance MgO capping layer for perpendicularly magnetized magnetic tunnel junctions

#26 | 2019-05-09
US20190140168A1
Electricity

Multilayer Structure for Reducing Film Roughness in Magnetic Devices

#27 | 2019-03-21
US20190088866A1
Electricity

Multilayer Structure for Reducing Film Roughness in Magnetic Devices

#28 | 2018-12-13
US20180358545A1
Electricity

Silicon oxynitride based encapsulation layer for magnetic tunnel junctions

#29 | 2018-11-15
US20180331279A1
Electricity

Combined physical and chemical etch to reduce magnetic tunnel junction (MTJ) sidewall damage

#30 | 2018-10-11
US20180294405A1
Electricity

Post treatment to reduce shunting devices for physical etching process

#31 | 2018-04-03
US15479522
Electricity

Dielectric encapsulation layer for magnetic tunnel junction (MTJ) devices using radio frequency (RF) sputtering

#32 | 2017-09-07
US20170256703A1
Electricity

Multilayer structure for reducing film roughness in magnetic devices

InventorID:

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