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Inventor profile of:

Junjun Liu

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2017-09-14

Top Assignees for applications by Junjun Liu

The entities that hold a legal rights for patent applications filed by inventor Liu Junjun:

BOE TECHNOLOGY GROUP CO., LTD. 1 Beijing, China
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD 1 Anhui, China

Recent patent applications by Liu Junjun

Junjun Liu from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-09-14

US20170265341A1

External-leadwire crimping apparatus

InventorID:

1985846 ⎘