Si Jun NIAN

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2017-10-19

Top Assignees for applications by Si Jun NIAN

The entities that hold a legal rights for patent applications filed by inventor NIAN Si Jun:

Si Jun NIAN from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Wafer cassette and placement method thereof

InventorID:

2016427 ⎘