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Inventor profile of:

William E. Bernier

City:

Endwell, New York

Country:

United States

Published Applications:

Last publication date:

2020-10-08

Top Assignees for applications by William E. Bernier

The entities that hold a legal rights for patent applications filed by inventor Bernier William E.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 12 ARMONK, NY United States
The Research Foundation for The State University of New York 4 Binghamton, NY United States
Crysta-Lyn Chemical Company, Inc. 1 Binghamton, NY United States
Leidos, Inc. 1 Reston, VA United States
The Research Foundation of State University of New York 1 Binghamton, NY United States

Recent patent applications by Bernier William E.

William E. Bernier from Endwell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-10-08

US20200316577A1

Performing operations; transporting

Metal oxide nanofibrous materials for photodegradation of environmental toxins

#2 | 2019-10-29

US15664833

Physics

Increased thermal stabilization of optical absorbers

#3 | 2018-03-22

US20180082912A1

Electricity

Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity

#4 | 2018-03-13

US14313296

Physics

Increased thermal stabilization of optical absorbers

#5 | 2017-03-02

US20170056873A1

Performing operations; transporting

Metal oxide nanofibrous materials for photodegradation of environmental toxins

#6 | 2015-02-05

US20150036716A1

Physics

Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity

#7 | 2014-09-18

US20140272342A1

Chemistry; metallurgy

Conductive films and devices comprised thereof

#8 | 2013-05-21

US13362228

Uniform solder reflow fixture

#9 | 2013-04-25

US20130098176A1

Electricity

Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity

#10 | 2008-01-10

US20080009101A1

Electricity

Compressible films surrounding solder connectors

#11 | 2008-01-03

US20080000080A1

Electricity

COMPLIANT ELECTRICAL CONTACTS

#12 | 2007-04-19

US20070084629A1

Electricity

Low stress conductive polymer bump

#13 | 2006-08-03

US20060172565A1

Electricity

Compliant electrical contacts

#14 | 2006-06-27

US9885853

Extension of fatigue life for C4 solder ball to chip connection

#15 | 2006-03-02

US20060043608A1

Electricity

Low stress conductive polymer bump

#16 | 2006-02-23

US20060040567A1

Electricity

Compressible films surrounding solder connectors

#17 | 2005-10-13

US20050224973A1

Electricity

Extension of fatigue life for C4 solder ball to chip connection

#18 | 2005-07-26

US10417690

Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder

InventorID:

202987 ⎘