Meylan
France
22
2025-07-24
The entities that hold a legal rights for patent applications filed by inventor Auchere David:
David Auchere from Meylan, FR has applied for patents for these inventions. The list has both pending applications and granted patents:
DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMINATED STRUCTURE COMPRISING DIELECTRIC LAYERS
#2 | 2025-02-27METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC DEVICE
#3 | 2024-09-26ELECTRONIC DEVICE
#4 | 2024-02-01INTEGRATED CIRCUIT PACKAGE
#5 | 2023-04-20Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#6 | 2023-01-19Electronic device comprising a chip and at least one SMT electronic component
#7 | 2022-09-22CHIP PACKAGING DEVICE AND CORRESPONDING MANUFACTURING METHOD
#8 | 2022-01-27Voltage regulating device
#9 | 2021-04-08Electronic device comprising a chip and at least one SMT electronic component
#10 | 2020-09-24Electronic device comprising an electronic component mounted on a support substrate and assembly method
#11 | 2020-07-16Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#12 | 2020-06-18METHOD FOR MOUNTING COMPONENT
#13 | 2020-04-16Electronic device provided with an integrated conductor element and fabrication method
#14 | 2019-07-11INSULATING CONTACTING SPACER
#15 | 2019-05-16Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#16 | 2019-02-28Electronic device including at least one electronic chip and electronic package
#17 | 2018-10-25Electronic device provided with an integrated conductor element and fabrication method
#18 | 2018-07-26Electronic device with integrated circuit chip provided with an external electrical connection network
#19 | 2018-05-03Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#20 | 2017-11-23Electronic device provided with an integrated conductor element and fabrication method
#21 | 2017-11-16Electronic device furnished with a conducting layer and method of fabrication
#22 | 2017-11-09Electronic device provided with an integral conductive wire and method of manufacture
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