🔗 Permalink

Inventor profile of:

Tiwei WEI

City:

Beijing

Country:

China

Published Applications:

1

Last publication date:

2017-11-09

Recent patent applications by WEI Tiwei

Tiwei WEI from Beijing, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-11-09

US20170323849A1

ADAPTER PANEL AND MANUFACTURING METHOD AND ENCAPSULATION STRUCTURE THEREOF AND BONDING METHOD FOR THE ADAPTER PANEL

InventorID:

2035142 ⎘