Hongfa Luan

City:

Hsinchu

Country:

Taiwan

Published Applications:

Last publication date:

2017-11-09

Top Assignees for applications by Hongfa Luan

The entities that hold a legal rights for patent applications filed by inventor Luan Hongfa:

Hongfa Luan from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor film with adhesion layer and method for forming the same

InventorID:

2035185 ⎘