Lothar Lehmann

City:

Radebeul

Country:

Germany

Published Applications:

Last publication date:

2014-01-23

Top Assignees for applications by Lothar Lehmann

The entities that hold a legal rights for patent applications filed by inventor Lehmann Lothar:

Lothar Lehmann from Radebeul, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER

Methods of forming bump structures that include a protection layer

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

InventorID:

205319 ⎘