Alexander Platz

City:

Ebersbach

Country:

Germany

Published Applications:

Last publication date:

2014-01-23

Top Assignees for applications by Alexander Platz

The entities that hold a legal rights for patent applications filed by inventor Platz Alexander:

Alexander Platz from Ebersbach, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROTECTION LAYER

Methods of forming bump structures that include a protection layer

Semiconductor Device Comprising a Die Seal with Graded Pattern Density

SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNECTION BASED ON METAL PILLARS

Semiconductor device including a reduced stress configuration for metal pillars

InventorID:

205320 ⎘