Tetsuya UEDA

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-01-09

Top Assignees for applications by Tetsuya UEDA

The entities that hold a legal rights for patent applications filed by inventor UEDA Tetsuya:

MITSUBISHI ELECTRIC CORPORATION 10 TOKYO, Japan
Mitsubishi Electric Corporation 3 Chiyoda-ku, Japan
MITSUBISHI ELECTRIC CORPORATION 2 Chiyoda-ku, Tokyo, Japan

Recent patent applications by UEDA Tetsuya

Tetsuya UEDA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-01-09

US20250016919A1

Electricity

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR

#2 | 2021-05-13

US20210142935A1

Electricity

Nonreciprocal circuit element and method of manufacturing the same

#3 | 2019-11-28

US20190361067A1

Physics

Insulating substrate inspecting method and inspecting apparatus

#4 | 2019-04-25

US20190123413A1

Electricity

Non-reciprocal circuit element and method for manufacturing the same

#5 | 2019-01-31

US20190037680A1

Electricity

Chip mounter, electronic circuit substrate, and power module

#6 | 2018-06-21

US20180174864A1

Electricity

Manufacturing method for semiconductor device

#7 | 2017-11-30

US20170345742A1

Electricity

Semiconductor device and manufacturing method thereof

#8 | 2012-12-13

US20120313252A1

Electricity

Semiconductor device

#9 | 2012-04-26

US20120098138A1

Electricity

Power semiconductor device

#10 | 2009-12-10

US20090302444A1

Electricity

Resin sealed semiconductor device and manufacturing method therefor

InventorID:

2053846 ⎘