Krishna R. Tunga

City:

Wappiners Falls, New York

Country:

United States

Published Applications:

Last publication date:

2017-12-07

Top Assignees for applications by Krishna R. Tunga

The entities that hold a legal rights for patent applications filed by inventor Tunga Krishna R.:

INTERNATIONAL BUSINESS MACHINES CORPORATION 1 ARMONK, NY United States

Recent patent applications by Tunga Krishna R.

Krishna R. Tunga from Wappiners Falls, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-12-07

US20170351783A1

Physics

Laminate substrate thermal warpage prediction for designing a laminate substrate

InventorID:

2059092 ⎘