Inventor profile of:

Dylan Murdock

City:

Bend, Oregon

Country:

United States

Published Applications:

16

Last publication date:

2025-10-23

Top Assignees for applications by Dylan Murdock

The entities that hold a legal rights for patent applications filed by inventor Murdock Dylan:

Recent patent applications by Murdock Dylan

Dylan Murdock from Bend, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-10-23
US20250329909A1
Electricity

MECHANICAL FASTENER ARRANGEMENTS IN SPATIAL POWER-COMBINING DEVICES AND RELATED METHODS

#2 | 2024-06-13
US20240195041A1
Electricity

STRUCTURAL ARRANGEMENTS FOR SPATIAL POWER-COMBINING DEVICES

#3 | 2024-02-15
US20240055319A1
Electricity

CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT

#4 | 2023-07-13
US20230223673A1
Electricity

Structural arrangements for spatial power-combining devices

#5 | 2023-02-02
US20230036197A1
Electricity

High power laminate RF package

#6 | 2022-09-01
US20220279676A1
Electricity

Thermal structures for heat transfer devices and spatial power-combining devices

#7 | 2022-08-04
US20220247061A1
Electricity

Power-combining devices with increased output power

#8 | 2022-02-10
US20220044981A1
Electricity

Hermetic package for high CTE mismatch

#9 | 2022-02-10
US20220044979A1
Electricity

Hermetic package for high CTE mismatch

#10 | 2021-09-23
US20210298207A1
Electricity

Thermal structures for heat transfer devices and spatial power-combining devices

#11 | 2020-05-21
US20200162046A1
Electricity

Structures for spatial power-combining devices

#12 | 2020-02-06
US20200041210A1
Mechanical engineering

Heat exchanger assemblies for electronic devices and related methods

#13 | 2020-02-06
US20200041209A1
Mechanical engineering

Heat exchanger assemblies for electronic devices

#14 | 2019-09-17
US16043710
Electricity

Environmentally robust plating configuration for metal-diamond composites substrate

#15 | 2018-07-19
US20180202722A1
Mechanical engineering

Heat transfer device incorporating a helical flow element within a fluid conduit

#16 | 2017-12-14
US20170358515A1
Electricity

Substrate with integrated heat spreader

InventorID:

2065199 ⎘