Victor, New York
United States
31
2020-12-24
The entities that hold a legal rights for patent applications filed by inventor Redding Gary D.:
Gary D. Redding from Victor, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers
#2 | 2020-09-10Imaging blanket and variable data lithography system employing the imaging blanket
#3 | 2020-07-16Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays
#4 | 2020-07-16Method of fabricating a plurality of linear arrays with submicron y-axis alignment
#5 | 2019-08-01Lead-free piezo printhead using thinned bulk material
#6 | 2018-12-06Lead-free piezo printhead using thinned bulk material
#7 | 2018-11-22Method of forming two-dimensional and three-dimensional semiconductor chip arrays
#8 | 2018-06-21System and method for cooling digital mirror devices
#9 | 2018-04-26Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers
#10 | 2018-01-25Raised fluid pass-through structure in print heads
#11 | 2017-10-26Method of forming piezo driver electrodes
#12 | 2017-06-08Extrusion printheads for three-dimensional object printers
#13 | 2016-11-24Pin-actuated printhead
#14 | 2016-08-25Raised fluid pass-through structure in print heads
#15 | 2016-06-28Membrane bond alignment for electrostatic ink jet printhead
#16 | 2016-06-09Method of manufacturing ink jet printheads including electrostatic actuators
#17 | 2016-04-05Printhead configured to refill nozzle areas with high viscosity materials
#18 | 2016-02-11Flex circuit board with topographical structures to facilitate fluid flow through the layer
#19 | 2015-09-03Electrostatic actuator with short circuit protection and process
#20 | 2015-07-07Electrostatic device improved membrane bonding
#21 | 2015-07-07Printhead layer design for compatibility with wet adhesive application processes
#22 | 2015-04-09Multi-layer electroformed nozzle plate with attenuation pockets
#23 | 2014-06-26Structure and method to fabricate tooling for bumping thin flex circuits
#24 | 2014-04-29Method for protecting piezoelectric transducer
#25 | 2014-03-13High density three-dimensional electrical interconnections
#26 | 2014-02-13Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays
#27 | 2013-09-05Print head transducer dicing directly on diaphragm
#28 | 2013-06-13Polymer film as an interstitial fill for PZT printhead fabrication
#29 | 2013-04-25Process for adding thermoset layer to piezoelectric printhead
#30 | 2012-12-27Method for interstitial polymer planarization using a flexible flat plate
#31 | 2012-11-01High density electrical interconnect for printing devices using flex circuits and dielectric underfill
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