Bucheon
South Korea
47
2026-06-18
The entities that hold a legal rights for patent applications filed by inventor IM Seungwon:
Seungwon IM from Bucheon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
#2 | 2026-06-18SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
#3 | 2026-06-11IMMERSION COOLING OF EMBEDDED ELECTRONIC COMPONENTS
#4 | 2026-06-11SEMICONDUCTOR DEVICE MODULE WITH STACKED INTERCONNECTIONS AND METHODS OF MANUFACTURE
#5 | 2026-06-04INPUT RESISTANCE FOR COMPACT PACKAGING OF SEMICONDUCTOR DIES
#6 | 2026-05-28HYBRID-MATERIAL LEADS FOR SOLDERLESS COUPLING OF AN ELECTRONIC COMPONENT
#7 | 2026-05-14COOLING ASSEMBLY INCLUDING MECHANICAL REINFORCEMENT TO PREVENT WARPAGE
#8 | 2026-03-26POWER MODULE PACKAGE
#9 | 2026-03-12TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
#10 | 2026-03-05SEMICONDUCTOR MODULES
#11 | 2026-02-19MECHANISMS FOR DUAL COUPLING A SEMICONDUCTOR PACKAGE ASSEMBLY TO A COMPONENT
#12 | 2026-01-08SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS
#13 | 2025-12-04TEMPERATURE SENSING WITHIN AN ELECTRONIC COMPONENT
#14 | 2025-11-13INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
#15 | 2025-09-04MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING
#16 | 2025-08-28DUAL COOL POWER MODULE WITH STRESS BUFFER LAYER
#17 | 2025-07-10THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
#18 | 2025-06-12HIGH POWER MODULE PACKAGE STRUCTURES
#19 | 2025-05-08SEMICONDUCTOR PACKAGE AND RELATED METHODS
#20 | 2025-05-08IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
#21 | 2025-05-01PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
#22 | 2025-04-17SUBMODULE SEMICONDUCTOR PACKAGE
#23 | 2025-04-17POWER MODULE AND RELATED METHODS
#24 | 2025-03-27LEADFRAME-LESS SEMICONDUCTOR DEVICE ASSEMBLIES WITH DUAL-SIDED COOLING
#25 | 2024-12-05POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
#26 | 2024-11-28METHOD OF DIRECT COOLING USING A CONDUCTIVE STRIP
#27 | 2024-10-31FAN OUT PACKAGE FOR A SEMICONDUCTOR POWER MODULE
#28 | 2024-08-22INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
#29 | 2024-08-01SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS
#30 | 2024-07-25Semiconductor device package assemblies with direct leadframe attachment
#31 | 2024-07-11SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
#32 | 2024-06-13FLUIDIC-CHANNEL COOLED SUBSTRATES
#33 | 2024-06-06MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
#34 | 2024-06-06DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
#35 | 2024-04-25SWITCHING OSCILLATION REDUCTION FOR POWER SEMICONDUCTOR DEVICE MODULES
#36 | 2024-04-25CURRENT SHARING MISMATCH REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
#37 | 2024-04-18POWER MODULE PACKAGE HAVING MIRRORED LEADS
#38 | 2024-04-11INTEGRATED SUBSTRATES AND RELATED METHODS
#39 | 2024-02-15TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
#40 | 2024-01-25TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
#41 | 2023-11-09MOLDED POWER MODULES
#42 | 2023-10-12TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
#43 | 2023-07-13STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
#44 | 2021-08-26Semiconductor package and related methods
#45 | 2019-11-14Semiconductor package and related methods
#46 | 2018-09-06Stray inductance reduction in packaged semiconductor devices and modules
#47 | 2017-12-21Semiconductor package and related methods
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