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Inventor profile of:

Steve BEZUK

City:

Poway, California

Country:

United States

Published Applications:

1

Last publication date:

2017-12-28

Recent patent applications by BEZUK Steve

Steve BEZUK from Poway, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-12-28

US20170373032A1

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) STRUCTURE

InventorID:

2077867 ⎘