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Inventor profile of:

Hitoshi MARUYAMA

City:

Annaka

Country:

Japan

Published Applications:

Last publication date:

2023-03-09

Top Assignees for applications by Hitoshi MARUYAMA

The entities that hold a legal rights for patent applications filed by inventor MARUYAMA Hitoshi:

SHIN-ETSU CHEMICAL CO., LTD 17 Tokyo, Japan

Recent patent applications by MARUYAMA Hitoshi

Hitoshi MARUYAMA from Annaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-03-09

US20230076103A1

Chemistry; metallurgy

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COATING, PHOTOSENSITIVE DRY FILM, PATTERN FORMATION METHOD

#2 | 2023-02-02

US20230030194A1

Physics

Photosensitive resin composition, photosensitive resin film, photosensitive dry film, patterning process, and light emitting device

#3 | 2020-05-28

US20200165456A1

Chemistry; metallurgy

Polysiloxane skeleton polymer, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

#4 | 2020-05-28

US20200165394A1

Chemistry; metallurgy

Siloxane polymer containing isocyanuric acid and polyether skeletons, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

#5 | 2020-04-16

US20200117089A1

Physics

Photosensitive resin composition, photosensitive dry film, and pattern forming process

#6 | 2020-01-23

US20200026190A1

Physics

Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix

#7 | 2020-01-23

US20200026189A1

Physics

Photosensitive resin composition and pattern forming process

#8 | 2019-11-21

US20190354014A1

Physics

Photosensitive resin composition, photosensitive dry film, and pattern forming process

#9 | 2019-11-21

US20190354013A1

Physics

Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

#10 | 2019-11-21

US20190352465A1

Chemistry; metallurgy

Polymer containing silphenylene and polyether structures

#11 | 2019-06-27

US20190196331A1

Physics

Photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device

#12 | 2019-02-28

US20190064666A1

Physics

Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process

#13 | 2019-02-14

US20190049844A1

Physics

Silicone structure-containing polymer, photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process

#14 | 2019-02-14