Avoca, New York
United States
9
2023-12-14
The entities that hold a legal rights for patent applications filed by inventor Levesque, JR. Daniel Wayne:
Daniel Wayne Levesque, JR. from Avoca, US has applied for patents for these inventions. The list has both pending applications and granted patents:
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
#2 | 2023-10-26SYSTEMS AND METHODS FOR FORMING WRAP AROUND ELECTRODES
#3 | 2020-08-20Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems
#4 | 2019-10-10Systems and methods for reducing substrate surface disruption during via formation
#5 | 2019-04-25METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS
#6 | 2019-03-07Inorganic wafer having through-holes attached to semiconductor wafer
#7 | 2018-04-19SILICA TEST PROBE AND OTHER SUCH DEVICES
#8 | 2018-03-08Articles having holes with morphology attributes and methods for fabricating the same
#9 | 2018-01-04Inorganic wafer having through-holes attached to semiconductor wafer
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