Adliswil
Switzerland
40
2020-05-07
The entities that hold a legal rights for patent applications filed by inventor Michel Bruno:
Bruno Michel from Adliswil, CH has applied for patents for these inventions. The list has both pending applications and granted patents:
Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#2 | 2018-03-29Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#3 | 2018-03-29Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#4 | 2016-02-18Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#5 | 2016-02-18Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#6 | 2014-03-27Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#7 | 2014-03-27Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#8 | 2013-01-10HEAT SPREADER
#9 | 2009-12-17Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#10 | 2009-12-17Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#11 | 2009-12-03Surface treatment
#12 | 2009-09-17Variable performance server system and method of operation
#13 | 2009-09-03Variable flow computer cooling system for a data center and method of operation
#14 | 2009-08-20Stamp for patterning, method for manufacturing such stamp and method for manufacturing an object using the stamp
#15 | 2009-04-30Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
#16 | 2009-02-12Printing in a medium
#17 | 2008-06-12Organic optoelectronic device
#18 | 2008-03-27Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
#19 | 2008-03-13HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
#20 | 2008-01-24Semiconductor device with a high thermal dissipation efficiency
#21 | 2008-01-03Method and device for flowing a liquid on a surface
#22 | 2007-11-29Fabrication method
#23 | 2007-10-04Semiconductor chip assembly with flexible metal cantilevers
#24 | 2007-05-31Cooling device
#25 | 2007-01-25Heat spreader
#26 | 2007-01-18Method and apparatus for surface treatment
#27 | 2006-12-21Thermal interface with a patterned structure
#28 | 2006-12-21Surface treatment
#29 | 2006-12-21Surface treatment
#30 | 2006-11-30High performance integrated MLC cooling device for high power density ICS and method for manufacturing
#31 | 2006-07-04Surface treatment
#32 | 2006-05-11Printing in a medium
#33 | 2006-05-09Selective etching of substrates with control of the etch profile
#34 | 2006-05-04Method and device for flowing a liquid on a surface
#35 | 2006-03-02Method and apparatus for manufacturing an optoelectronic device
#36 | 2005-12-15Semiconductor device with a high thermal dissipation efficiency
#37 | 2005-12-01Patterned structure for a thermal interface
#38 | 2005-09-01System, method, and apparatus for mechanically releasable slider processing including lapping, air bearing patterning, and debonding
#39 | 2005-09-01System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
#40 | 2005-06-09Patterning method
20885 ⎘