Tomohisa MITOSE

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2025-06-26

Top Assignees for applications by Tomohisa MITOSE

The entities that hold a legal rights for patent applications filed by inventor MITOSE Tomohisa:

Tomohisa MITOSE from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

BONDED STRUCTURE

MOUNTING BOARD AND CIRCUIT BOARD

MOUNTING BOARD AND CIRCUIT BOARD

JOINT STRUCTURE

Soft magnetic metal powder, method for producing the same, and soft magnetic metal dust core

SOFT MAGNETIC METAL POWDER AND DUST CORE

InventorID:

2094945 ⎘