Plano, Texas
United States
9
2022-02-03
The entities that hold a legal rights for patent applications filed by inventor CHAM Pak Meng:
Pak Meng CHAM from Plano, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Multi-layered packaging films
#2 | 2017-06-22Transverse sonotrode design for ultrasonic welding
#3 | 2016-01-07Ultrasonic sealing of packages
#4 | 2015-07-30Transverse Sonotrode Design for Ultrasonic Welding
#5 | 2014-07-31Long chain branched (LCB), block, or interconnected copolymers of ethylene in combination with one other polymer
#6 | 2014-02-06Ultrasonic sealing of packages
#7 | 2014-02-06Ultrasonic sealing of packages
#8 | 2014-01-23Long chain branched (LCB), block or interconnected copolymers of ethylene in combination with one other polymer
#9 | 2013-04-25BARRIER PAPER PACKAGING AND PROCESS FOR ITS PRODUCTION
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