Annaka
Japan
14
2014-07-03
The entities that hold a legal rights for patent applications filed by inventor Aga Hiroji:
Hiroji Aga from Annaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer
#2 | 2014-04-10Method for manufacturing bonded wafer and bonded SOI wafer
#3 | 2013-11-28Method for manufacturing SOI wafer
#4 | 2013-04-25METHOD FOR MANUFACTURING BONDED WAFER
#5 | 2012-09-27Method for producing bonded wafer
#6 | 2011-11-17METHOD FOR MANUFACTURING SOI WAFER
#7 | 2011-09-15Method for manufacturing SOI wafer
#8 | 2011-06-23METHOD FOR MANUFACTURING BONDED WAFER
#9 | 2011-05-05Method for manufacturing bonded wafer
#10 | 2010-05-13Method for manufacturing bonded wafer
#11 | 2008-06-05Method of manufacturing SOI wafer and thus-manufactured SOI wafer
#12 | 2006-02-23Method of fabricating SOI wafer
#13 | 2006-02-14SOI wafer producing method, and wafer separating jig
#14 | 2005-05-24Method of manufacturing a bonded wafers using a Bernoulli chuck
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