Daisuke MARUYAMA

City:

Iruma-shi

Country:

Japan

Published Applications:

Last publication date:

2024-02-29

Top Assignees for applications by Daisuke MARUYAMA

The entities that hold a legal rights for patent applications filed by inventor MARUYAMA Daisuke:

Daisuke MARUYAMA from Iruma-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

SOLDER ALLOY, JOINT PORTION, JOINING MATERIAL, SOLDER PASTE, JOINT STRUCTURE, AND ELECTRONIC CONTROL DEVICE

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

InventorID:

2103393 ⎘