Underhill, Vermont
United States
17
2015-04-30
The entities that hold a legal rights for patent applications filed by inventor Sullivan Timothy Dooling:
Timothy Dooling Sullivan from Underhill, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Structures and methods for monitoring dielectric reliability with through-silicon vias
#2 | 2013-10-03Method of changing reflectance or resistance of a region in an optoelectronic memory device
#3 | 2013-01-10Ball-limiting-metallurgy layers in solder ball structures
#4 | 2012-11-15OPTOELECTRONIC MEMORY DEVICES
#5 | 2012-09-27Wafer edge conditioning for thinned wafers
#6 | 2012-08-09Enhanced electromigration resistance in TSV structure and design
#7 | 2012-08-09Enhanced electromigration resistance in TSV structure and design
#8 | 2011-11-24Optically transparent wires for secure circuits and methods of making same
#9 | 2010-11-18Optoelectronic memory devices
#10 | 2010-10-14Ball-limiting-metallurgy layers in solder ball structures
#11 | 2010-06-03Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
#12 | 2009-11-05Optically transparent wires for secure circuits and methods of making same
#13 | 2009-08-27Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature
#14 | 2008-11-06Through-wafer vias
#15 | 2008-10-30Structure for charge dissipation during fabrication of integrated circuits and isolation thereof
#16 | 2008-08-28Integration circuits for reducing electromigration effect
#17 | 2007-01-18Method and structure for charge dissipation during fabrication of integrated circuits and isolation thereof
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