Trofaiach
Austria
59
2025-02-27
The entities that hold a legal rights for patent applications filed by inventor Leitgeb Markus:
Markus Leitgeb from Trofaiach, AT has applied for patents for these inventions. The list has both pending applications and granted patents:
IC SUBSTRATE HAVING CENTRAL SECTION WITH VERTICALLY STACKED FUNCTIONAL VOLUME SECTIONS
#2 | 2025-02-20PACKAGE WITH IC SUBSTRATE AND ELECTRONIC COMPONENT CONNECTED WITH DIRECT PHYSICAL CONTACT
#3 | 2025-01-30IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
#4 | 2024-12-26Component Carrier with Stack-Stack Connection for Connecting Components
#5 | 2024-12-19Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method
#6 | 2024-08-29Component Carrier For Waveguide Applications
#7 | 2023-12-21Component Carrier For Waveguide Applications
#8 | 2023-09-21Component carrier with stack-stack connection for connecting components
#9 | 2023-09-21Component Carrier with Surface Mounted Components Connected By High Density Connection Region
#10 | 2023-05-04Component Embedded in Component Carrier and Having an Exposed Side Wall
#11 | 2023-03-23Electronic Package with Components Mounted at Two Sides of a Layer Stack
#12 | 2022-06-16Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an Antenna
#13 | 2021-10-14Interposer-type component carrier and method of manufacturing the same
#14 | 2021-09-09Heat removal mechanism for stack-based electronic device with process control component and processing components
#15 | 2021-06-10Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature
#16 | 2021-05-13Component carrier with exposed layer
#17 | 2021-03-18Electronic module with single or multiple components partially surrounded by a thermal decoupling gap
#18 | 2021-02-11Protection layer for panel handling systems
#19 | 2020-09-24Interposer-type component carrier and method of manufacturing the same
#20 | 2020-04-23Z-axis interconnection with protruding component
#21 | 2020-04-23Surface Mounted Device in Cavity
#22 | 2020-04-09Component carrier with face-up and face-down embedded components
#23 | 2019-12-12RF functionality and electromagnetic radiation shielding in a component carrier
#24 | 2019-10-03Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact Structure
#25 | 2019-09-26Hybrid component carrier and method for manufacturing the same
#26 | 2019-07-18Flame retardant structure for component carrier
#27 | 2019-07-18Highly thermally conductive dielectric structure for heat spreading in component carrier
#28 | 2019-06-06Cooling component carrier material by carbon structure within dielectric shell
#29 | 2019-05-16Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure
#30 | 2019-05-09Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions
#31 | 2019-04-11Component carrier having a three dimensionally printed wiring structure
#32 | 2019-04-11Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure
#33 | 2019-02-07Component embedded in component carrier and having an exposed side wall
#34 | 2018-10-25Connection Panel for Electronic Components
#35 | 2018-09-27Electronic device with embedded electronic component
#36 | 2018-09-27Component carrier with integrated antenna structure
#37 | 2018-09-13Hybrid component carrier and method for manufacturing the same
#38 | 2018-09-13USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTED CIRCUIT BOARD
#39 | 2018-03-08Component carrier comprising a deformation counteracting structure
#40 | 2018-03-01Matching inclination of cavity sidewall and medium supply device for manufacturing component carrier
#41 | 2017-11-09MEMS Package
#42 | 2017-08-17Printed circuit board
#43 | 2017-03-30Conductor track with enlargement-free transition between conductor path and contact structure
#44 | 2017-03-02PCB-based connector device
#45 | 2016-11-10Printed Circuit Board
#46 | 2016-04-14Printed circuit board
#47 | 2015-11-26Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board
#48 | 2015-08-20Printed circuit board comprising an electronic component integrated therein
#49 | 2014-12-25Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a Method
#50 | 2014-11-13Method for the production of a circuit board involving the removal of a subregion thereof
#51 | 2014-08-07METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD
#52 | 2014-01-09METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A CIRCUIT BOARD ELEMENT AND CARRIER FOR USE IN SUCH A METHOD
#53 | 2013-07-11Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board
#54 | 2013-06-13NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR
#55 | 2013-01-10Method for integrating an electronic component into a printed circuit board
#56 | 2011-11-10Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method
#57 | 2010-03-11Method for removing a part of a planar material layer and multilayer structure
#58 | 2010-02-04Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board
#59 | 2010-01-14Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
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