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Inventor profile of:

Ryuji UENO

City:

Tokyo

Country:

Japan

Published Applications:

10

Last publication date:

2024-12-26

Top Assignees for applications by Ryuji UENO

The entities that hold a legal rights for patent applications filed by inventor UENO Ryuji:

MITSUBISHI ELECTRIC CORPORATION 7 TOKYO, Japan
MITSUBISHI ELECTRIC CORPORATION 3 Chiyoda-ku, Tokyo, Japan
NEC Corporation 1 Tokyo, Japan

Recent patent applications by UENO Ryuji

Ryuji UENO from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2024-12-26

US20240430015A1

SUBMARINE BRANCHING APPARATUS AND CONTROL METHOD OF SUBMARINE BRANCHING APPARATUS

#2 | 2024-10-03

US20240332052A1

WAFER HOUSING CONTAINER AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#3 | 2024-09-26

US20240321750A1

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#4 | 2022-02-17

US20220049357A1

Chemistry; metallurgy

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

#5 | 2021-05-13

US20210143269A1

Semiconductor device and manufacturing method thereof

#6 | 2019-12-26

US20190393173A1

Method of manufacturing a semiconductor element front side electrode

#7 | 2019-08-29

US20190267256A1

Semiconductor-manufacturing apparatus and method for manufacturing semiconductor device

#8 | 2019-08-08

US20190244819A1

Semiconductor device including a reactant metal layer disposed between an aluminum alloy film and a catalyst metal film and method for manufacturing thereof

#9 | 2018-05-17

US20180138135A1

Semiconductor element having a warped surface and production method thereof

#10 | 2018-02-01

US20180033694A1

Semiconductor device manufacturing method

InventorID:

2107526 ⎘