Daniel Butz

City:

Madison, Wisconsin

Country:

United States

Published Applications:

Last publication date:

2020-05-14

Top Assignees for applications by Daniel Butz

The entities that hold a legal rights for patent applications filed by inventor Butz Daniel:

Daniel Butz from Madison, US has applied for patents for these inventions. The list has both pending applications and granted patents:

Method for improving resistance to breakage and eggshell strength

FGF-23 epitope peptide for improving resistance to breakage and eggshell strength

InventorID:

2116402 ⎘