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Inventor profile of:

Munetoshi IRISAWA

City:

Tokyo

Country:

Japan

Published Applications:

6

Last publication date:

2020-01-09

Top Assignees for applications by Munetoshi IRISAWA

The entities that hold a legal rights for patent applications filed by inventor IRISAWA Munetoshi:

  • MITSUBISHI PAPER MILLS LIMITED 5 Tokyo, Japan
  • Shinko Electric Industries Co., Ltd. 2 Nagano-shi, Japan
  • SHINKO ELECTRIC INDUSTRIES CO., LTD. 1 Nagano-shi, Nagano, Japan

Recent patent applications by IRISAWA Munetoshi

Munetoshi IRISAWA from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-01-09
US20200012190A1
Physics

Photosensitive resin composition, etching method and plating method

#2 | 2018-02-15
US20180046079A1
Physics

Photosensitive resin composition and etching process

#3 | 2010-12-30
US20100330504A1
Electricity

Method for electroconductive pattern formation

#4 | 2009-09-24
US20090236137A1
Electricity

Method for forming resist pattern, method for producing circuit board, and circuit board

#5 | 2009-07-09
US20090173245A1
Performing operations; transporting

Method for Manufacturing Screen Printing Mask With Resin and Screen Printing Mask With Resin

#6 | 2007-08-09
US20070181994A1
Electricity

Circuit board manufacturing method and circuit board

InventorID:

2117973 ⎘

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